Silicon Wafer Laser Cutting Machine
Product Details:
| Application | Laser Scribing |
|---|---|
| Laser Type | YAG |
| Place of Origin | Guangdong, China |
| Brand Name | YUEMAO LASER |
| Model Number | YMS-50&YMS-10D |
Payment & Shipping Terms:
| Packaging Details: | WOODEN CASE |
|---|---|
| Payment Terms: | L/C,T/T |
Detailed Product Description
Silicon Wafer Laser Cutting Machine is capable of cutting various silicon wafer, in industries of semiconductor and solar energy, etc. It is designed by experts with professional features, such as excellent beam quality and power stability, precise CNC worktable and efficient auto cooling system. Some of the most important parts are manufactured in UK, USA and Germany. Thanks to the automatic control of the whole system, you can save more efforts on the manufacturing, instead of how to operate and maintain the system.
FEATURES:
1. Excellent beam quality and system reliability
2. High-speed scribing (up to 300 mm/s), very low-defective index
3. Auto cooling system
4. Precise CNC worktable
5. Friendly man-machine interface and simple software operation.
TECHNICAL PARAMETERS:
Model: | YMS-10D | YMS-50 |
Laser: | Diode pumped | Lamp pumped |
Scribing speed, mm/s: | 300 | 120 |
Min kerf width, mm: | 0.02 | 0.05 |
Frequency, kHz: | 0-100 | 0.5-50 |
Cooling medium: | Air | DI Water |
Pumping source life, h: | 20,000 | 800-1,000 |
Maintenance interval, month: | 12 | 3 |
Optics alignment: | Easy | Not easy |
Silicon Wafer Laser Cutting Machine
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Company Info
Zhuhai Yuemao Laser Facility Engineering Co., Ltd.
[China]
[Verified Member]
Online Postings: Products
Business Type:Manufacturer
City: Zhuhai
Province/State: Guangdong
Country/Region : China